Wafer protection for semiconductor manufacturing process
ICROS™ TAPE
Tape for semiconductor manufacturing
Applications detail
Applications
Characteristics
- Basic information
Summary
ICROS™ Tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow, such as dicing, packaging process.
Each layer has different functions and combination of multiple layers provides various solutions for your needs. We offer the best proposal for your process from dozens of our tapes from our portfolio.
Thermal Release Double sided Tape
The materials bonded on thermal release adhesive layer can be released automatically by heating.
Contact Us
Mitsui Chemicals Europe GmbH, Trading Business Division
TEL
+49 (0) 211-17332-0
MAIL
marketing@mcie.de