Tape for semiconductor manufacturing

Applications detail

Wafer protection for semiconductor manufacturing process


ICROS™ Tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow, such as dicing, packaging process.

ICROS™ Tape Summary

Each layer has different functions and combination of multiple layers provides various solutions for your needs. We offer the best proposal for your process from dozens of our tapes from our portfolio.

ICROS™ Tape Characteristics

Thermal Release Double sided Tape

The materials bonded on thermal release adhesive layer can be released automatically by heating.

Contact Us

Mitsui Chemicals Europe GmbH, Trading Business Division
TEL +49 (0) 211-17332-0